RZ/G1E SMARC Module

RZ/G1E SMARC Module and SMARC Development Kit

The Renesas RZ/G1E SMARC Module and SMARC Dev Kit from Mistral are small form-factor, high performance module and development platform  built around 1GHz Renesas RZ/G1E dual ARM Cortex-A7 processor. Along with 3D Graphics Engine and Video processing units on the MPU, RZ/G1E SMARC Module from Mistral supports dual camera, dual display ports, dual Ethernet and most of the interfaces of SMARC 1.0 standard.

The RZ/G1E SMARC Module and RZ/G1E SMARC Development Kit (SMARC Dev Kit) consist of MPU, PMIC, DDR3, eMMC, Ethernet PHYs, HDMI transmitter, CSI-to-parallel bridge and other interfaces terminated on the 314 edge fingers. The edge fingers can be mated with an MXM3-style socket on the Carrier board. The RZ/G1E SMARC Module is designed in compact size 82mm x 50mm with 1.2mm PCB thickness. This ready to use SMARC module is an ideal building block for any portable or stationary embedded systems.

FEATURES

• Renesas RZ/G1E ARM ® Cortex-A7 Dual Core MPU
• 82mm x 50mm
• 1GByte DDR3
• 4GByte eMMC
• 314 edge fingers as per SMARC 1.0 standard
• Standard Linux kernel 3.10

SPECIFICATIONS 

*Among these four interfaces only two can be used simultaneously.

For customization or volume pricing, please contact sales@mistralsolutions.com

SMARC Dev Kit

OVERVIEW

The RZ/G1E SMARC Dev Kit designed by Mistral is a powerful SMARC Development Kit based on 1GHz Renesas RZ/G1E dual ARM ® Cortex-A7 microprocessor (MPU). The SMARC Dev Kit from Mistral has dual board architecture, consisting of RZ/G1E SMARC module and carrier board.

The RZ/G1E  SMARC Dev Kit based on the RZ/G1E MPU includes DDR3, eMMC, PMIC, Ethernet PHYs, HDMI transmitter, MIPI CSI-to-Parallel converter and other interfaces terminated on the 314 edge fingers. This module is SMARC 1.0 complaint. The Carrier board on the SMARC Development Kit includes connectors and supporting ICs for validating edge finger interfaces like MIPI CSI and parallel camera, analog video input, HDMI and parallel display, 10/100 and Gigabit Ethernet, USB interface, Audio interface, micro-SD card and SDIO based Wireless module. The SMARC Dev Kit supports additional interfaces like SPI (MSIOF), I2C, CAN, PWM, GPIO, UART (SCIF) on expansion connector/terminal blocks.

A DC jack provided on the SMARC Development Kit serves as primary power source for both RZ/G1E SMARC module as well as carrier board. The RZ/G1E SMARC Dev Kit also provides debug options using JTAG and UART (SCIF) interfaces.

FEATURES

• SMARC based platform for accelerated development
• Dual board architecture:
  • SMARC Module : MPU, Memory, PMIC, HDMI transmitter, Ethernet PHY
  • Carrier Board: Display, video, audio, wireless, USB, connectivity and other interfaces
• Standard Linux kernel 3.10
• Reusable SMARC module reduces time-to-market and manufacturing complexity

SPECIFICATIONS

Carrier Board

Software

The RZ/G1E SMARC Module and SMARC Dev  Kit comes with BSP Binaries Standard Linux kernel 3.10 that will be available online. The software package consists of:

• SPI-loader and uBoot
• Yocto Linux Drivers and BSP (Linux Version 3.10)
• Drivers
  • Camera
  • Audio
  • WiFi & BT
  • LCD + Touch screen
  • HDMI
  • USB
  • RMII, GMII Ethernet
  • Serial port
  • SD/eMMC

Infographics

About SMARC

SMARC (‘Smart Mobility ARChitecture’) is a specification published by the Standardization Group for Embedded Technologies e.V. (SGET) for computer-on-modules (COMs). The SMARC (“Smart Mobility ARChitecture”) is a versatile small form factor computer Module definition targeting applications that require low power, low costs, and high performance. The SMARC Modules will typically use ARM SOCs similar or the same as those used in many familiar devices such as tablet computers and smart phones. Alternative low power SOCs and CPUs, such as tablet oriented X86 devices and other RISC CPUs may be used as well. As per the standard, two Module sizes are defined:

• 82mm x 50mm
• 82mm x 80mm

The Module PCBs have 314 edge fingers that mate with a low profile 314 pin 0.5mm pitch right angle connector (the connector is sometimes identified as a 321 pin connector, but 7 pins are lost to the key).
The Modules are used as building blocks for portable and stationary embedded systems. The core CPU and support circuits, including DRAM, boot flash, power sequencing, CPU power supplies, GBE and a display transmitter are concentrated on the Module. The Modules are used with application specific Carrier Boards that implement other features such as audio CODECs, touch controllers, wireless devices, etc. The modular approach allows scalability, fast time to market and upgradability while still maintaining low costs, low power and small physical size.

Click on the links below to access the design guides and specifications documents:

SMARC Design Guide V1.02.0 M (SMARC DG V1p0.pdf)

SMARC Hardware Specification V1.11.9 M (SMARC Hardware Specification V1p1.pdf)

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