Mistral’s CTO Rajeev Ramachandra gave the Key note address at the One Day Workshop on High Density Interconnect Technology held at ISAC in Bangalore on the 29th of January. The workshop was aimed at creating awareness among the designer community regarding HDI technology.
High Density Interconnect (HDI) technology promises to be the next generation in Space Electronics by accommodating fine-pitch, high pin count devices like array packages. It has advantages in weight, volume and better electrical performance.
There were several demos from Mistral displayed at the event which highlighted the end-to-end solutions and services offered across all Defense domains targeting applications in ground based, airborne and naval systems. Also demonstrated was the Wearable Headset computer designed by Mistral.
